Integration
From the perspective of the manufacturing process, the circuits and devices in the CCD are integrated in the semiconductor single crystal material manufacturer, and the process is more complicated. Only a few manufacturers in the world can produce CCD wafers, such as DALSA, SONY, Panasonic, etc. The CCD can only output analog electrical signals, which requires subsequent address decoders, analog converters, and image signal processors, and it also needs to provide three sets of power supply synchronous clock control circuits with different voltages. The integration is very low. CMOS is integrated on a monolithic material called metal oxide. This process is the same as the process of producing tens of thousands of semiconductor chips such as computer chips and storage devices. Therefore, the cost of sound field CMOS is much lower than that of CCD . At the same time, the CMOS chip can integrate the image signal amplifier, signal reading circuit, A / D conversion circuit, image signal processor and controller into a single chip, and only one chip can realize all the basic functions of the camera. High, chip-level camera concepts are born from this. With the continuous development of CMOS imaging technology, more and more companies can provide high-quality CMOS imaging chips, including: Micron, CMOSIS, Cypress, etc.